EU Launches Chips JU Pilot Lines to Boost Semiconductor Innovation The European Union (EU) has taken a significant stride towards enhancing semiconductor innovation and manufacturing capabilities with the introduction of the Chips Joint Undertaking (JU) pilot lines. With a substantial investment of €3.7 billion, this initiative aims to revolutionize the semiconductor industry in Europe, fostering […]
SK Hynix to Commence Mass Production of Advanced HBM3E 12-Layer Chips
In a significant development for the semiconductor industry, SK Hynix, the world’s second-largest memory chip manufacturer, is poised to initiate mass production of its cutting-edge HBM3E (High Bandwidth Memory) 12-layer chips by the end of September 2024. This announcement was made by Justin Kim, the president of SK Hynix’s AI Infra division, during the Semicon […]