The world of computing is on the brink of a significant transformation, thanks to the innovative research being conducted by faculty members at the University of Dallas. With a generous grant of $1.9 million from the National Science Foundation’s Future of Semiconductors (FuSe2) program, these researchers, along with industry partners, are setting the stage for a new generation of computer chips by harnessing the potential of indium-based materials. This initiative aligns perfectly with the goals of the federal CHIPS Act of 2022, which aims to enhance the efficiency and domestic production of semiconductors.
The focus of their research is twofold. Firstly, the introduction of indium-based materials seeks to improve lithography techniques used in semiconductor fabrication. Lithography, a pivotal stage in the manufacturing process, involves creating precise patterns on silicon wafers that will serve as pathways for transistors and other components. Traditional methods that use deep ultraviolet (DUV) light are being left behind in favor of extreme ultraviolet (EUV) lithography, which employs extremely high-energy photons for even more precise patterning.
Currently, the challenge lies in the conventional photoresist materials that cannot function effectively under the high-energy conditions of EUV. The research team at the University of Dallas is stepping up to address this issue by developing new indium-containing alternatives that promise greater efficiency. Dr. Julia Hsu, professor of materials science and engineering and the study’s leader, explained, “If you are making a layer of devices on top of another layer of devices, you cannot heat it to a high temperature. Otherwise, you will destroy the existing layers.” By utilizing these indium-based materials, the manufacturing process could eliminate certain steps that rely on solvents, streamlining operations while enhancing the overall performance of the chips produced.
A remarkable facet of this research is its potential to pave the way for 3D circuits. Traditional chip designs are largely confined to two dimensions, but with the introduction of multi-layered structures, akin to high-rises in a densely populated city, the computing capacity can be significantly increased. This innovation relies on the ability to stack layers of chips without adversely affecting the existing layers. The use of indium can facilitate this intricate design while maintaining the integrity of the entire assembly.
One of the standout approaches being developed is a technique called photonic curing. This method harnesses bursts of light, characterized by high intensity but low energy, to induce chemical reactions. This innovative technique aims to convert EUV-patterned structures into nanoscale devices effectively. The advantage of photonic curing becomes apparent as it enables indium oxide to attain improved semiconducting properties without overheating existing layers of devices, which is a critical factor in maintaining functionality.
The collaboration among researchers extends beyond the University of Dallas. With the engagement of professionals like Dr. Cormac Toher, an assistant professor of materials science and a computational materials scientist, and Dr. Kevin Brenner, who specializes in device fabrication, the project is built on a foundation of interdisciplinary knowledge and expertise. Together, they aim to design indium-containing molecules and fabricate and test novel devices that may revolutionize current semiconductor technologies.
Moreover, this initiative is not solely focused on research and development; it also includes a significant commitment to workforce training in semiconductor technologies. Through UTD’s North Texas Semiconductor Institute, community college students will benefit from structured training programs, gaining hands-on experience and knowledge about the semiconductor industry. Dr. Hsu plans to incorporate experiential learning in her coursework, providing students with immersive experiences that will prepare them for careers in this vital sector.
The future of computer chips relies on innovative solutions that enhance energy efficiency and production capabilities. By harnessing the capabilities of indium-based materials, the research at the University of Dallas stands as a beacon of hope for simpler, more effective manufacturing processes. The anticipated outcomes not only promise superior performance in computer chips but also align with national goals to bolster domestic semiconductor production.
As this project unfolds, its strategic alignment with broader industry needs makes it a pivotal undertaking in the shift toward a more efficient and technologically advanced future. With the potential impact on various sectors, from consumer electronics to advanced computing systems, the collaborative efforts behind this project may set a new course for the semiconductor industry.
The journey towards better semiconductor technologies is indeed exciting, and the groundwork being laid today will define the next generation of computational power.
